IEC 60352-5 standard, titled "Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance,"
: A press-fit connection is formed by inserting a termination (pin) with a compliant "press-in zone" into a plated-through hole of a circuit board. iec 60352-5 pdf
In the world of modern electronics, soldering isn't always the best—or most efficient—way to connect components to a circuit board. Solderless have become a cornerstone of high-reliability industries like automotive and telecommunications. To ensure these connections last, engineers turn to the IEC 60352-5 standard . IEC 60352-5 standard
The increasing demand for miniaturization and high-density mounting of electronic components has driven the development of surface mount technology (SMT). Solderless connections, also known as press-fit or mechanical connections, have become a popular alternative to traditional soldering methods. These connections provide a reliable and efficient way to interconnect components on a printed circuit board (PCB) without the need for soldering. test methods and practical guidance
Adds requirements for documenting press-in and push-out forces to better understand mechanical performance. Refined Testing:
Following this standard allows for comparable test results even when using different tool designs. It provides a clear roadmap for environmental testing (like mechanical shock and atmospheric exposure) to ensure your product survives its lifecycle.
The standard outlines specific test schedules to validate performance, including: